AMD CEO Lisa Su and C-level executives from other companies are scheduled to visit Taiwan in late September/early November to discuss cooperation with local partners. Among the companies AMD management will meet with are Taiwan Semiconductor Manufacturing Company, a chip packaging specialist, and a major PC manufacturer.
Lisa Su will discuss future collaborations during a visit with TSMC CEO CC Wei. Among the topics are TSMC’s ‘N3 Plus’ manufacturing node (presumably her N3P) and usage of N2 (2nm class) manufacturing technology. Digi Times (opens in new tab) Cite sources that you know about. In addition, the CEOs of both companies will discuss plans for future orders. This includes technology that is available or will be available in the near future.
AMD’s remarkable success in recent years has been made possible in large part by its ability to mass-produce chips using TSMC’s highly competitive process technology. In order to continue its relentless success, AMD needs to secure enough quota in his TSMC to give them early access to the foundry’s latest Process Design Kit (PDK). TSMC will start mass-producing chips at the N2 node in the second half of 2025, so it’s time for AMD to start talking about using N2 in its 2026 and beyond products.
In addition to TSMC’s advanced semiconductor manufacturing technology, AMD’s future success depends on advanced chip packaging technology. AMD (like other chip designers) uses multi-chiplet chip packaging technology extensively.
As such, AMD’s Lisa Su will also discuss their collaboration in the advanced packaging space with TSMC, Ase Technology, and SPIL. Currently, AMD is part of TSMC’s 3D SoIC (system-on-integrated-chip) platforms such as CoWoS (Chip-on-Wafer on a Substrate) packaging technology and Ase’s Fan-Out Embedded Bridge (FO-EB) packaging method. is already used.According to the product Digi Times (opens in new tab)However, the use of innovative packaging will only increase in the future, so AMD will have to negotiate allocations and prices up front.
In addition to long-term plans, AMD’s C-level executives will discuss more practical things such as supplying the sophisticated printed circuit boards (PCBs) used in CPUs (this is AMD server CPU is one of the factors restraining shipments of Providing Ajinomoto Build-Up Film (ABF) for these PCBs with partners such as Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology.
Finally, AMD executives will meet with Asus and Acer, two major Taiwanese PC makers with close ties to American chip designers, and ASMedia, which develops chipsets for AMD.
