Gaming PC

AMD CEO to Negotiate 2nm, 3nm Chip Supplies With TSMC

AMD CEO Lisa Su and C-level executives from other companies are scheduled to visit Taiwan in late September/early November to discuss cooperation with local partners. Among the companies AMD management will meet with are Taiwan Semiconductor Manufacturing Company, a chip packaging specialist, and a major PC manufacturer.

Lisa Su will discuss future collaborations during a visit with TSMC CEO CC Wei. Among the topics are TSMC’s ‘N3 Plus’ manufacturing node (presumably her N3P) and usage of N2 (2nm class) manufacturing technology. Digi Times (opens in new tab) Cite sources that you know about. In addition, the CEOs of both companies will discuss plans for future orders. This includes technology that is available or will be available in the near future.

AMD’s remarkable success in recent years has been made possible in large part by its ability to mass-produce chips using TSMC’s highly competitive process technology. In order to continue its relentless success, AMD needs to secure enough quota in his TSMC to give them early access to the foundry’s latest Process Design Kit (PDK). TSMC will start mass-producing chips at the N2 node in the second half of 2025, so it’s time for AMD to start talking about using N2 in its 2026 and beyond products.

(Image credit: TSMC)

In addition to TSMC’s advanced semiconductor manufacturing technology, AMD’s future success depends on advanced chip packaging technology. AMD (like other chip designers) uses multi-chiplet chip packaging technology extensively.

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