Gaming PC

Intel Details 3D Chip Packaging Tech for Meteor Lake, Arrow Lake and Lunar Lake

Intel today revealed new details about the 3D Foveros chip design it will use for its Meteor Lake, Arrow Lake and Lunar Lake chips as a teaser for the company’s presentation at Hot Chips 34, the semiconductor industry conference that looks at the tech-sharing giants. did. Architectural details of new processors. Intel CEO Pat Gelsinger delivered the event’s keynote, and the company also announced four of his technology presentations, including the consumer-grade “Lake” processors discussed here, Ponte Vecchio GPUs, FPGAs, and Xeon D processors. to hold.

First and foremost, there have been rumors recently that Intel’s Meteor Lake launch to market would be delayed due to Intel switching GPU tiles/chiplets from the TSMC 3nm node to the 5nm node. Intel has not yet shared information about the specific node it will use for the GPU, but a company representative said the planned node for the GPU tile has not changed and the processor is gearing up for an on-time release in 2023. is progressing smoothly.

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