Gaming PC

Ryzen 7000 I/O Die Cracks Into Five Tiny Chiplets During Experiment

fritzens fritzKnown for his IR photos of processors, he recently shared an image comparing the Ryzen 5 7600 and the Ryzen 7 7800X3D. This famous photographer has explained the unfortunate incident regarding the Ryzen 5 7600. His I/O die on a hexa-core chip unexpectedly cracked during some tests before taking thermal images of the processor. However, it’s important to note that Fritz’ experience has not shown him to have problems with Ryzen 7000 processors.

Fritz ignored the Ryzen 5 7600 and ran it on Thermal Grizzly’s Ryzen 7000 direct die frame without a heatsink. He pointed out that the temperature of the I/O die (IOD) is around 80 degrees Celsius, while the temperature of the single core complex die (CCD) has dropped to 95 degrees Celsius. He used thermal imaging to capture the bounce of the core. Ryzen 5 7600 he was running Cinebench single core tests which produced image artifacts and finally he crashed the system after 60 seconds.

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