There are plenty of high-performance gaming systems, and fanless PCs capable of running basic multimedia and productivity applications. Unfortunately, the spheres of gaming and fanless technology rarely overlap, resulting in a shortage of passively cooled gaming desktops, which often use custom-made and expensive components. However, Streacom wants to change that and make fanless gaming systems more popular.
Streamom SG10 will be exhibitedis a PC chassis that can dissipate up to 600W of heat energy without the use of a fan and was announced at Computex in late May. This case was developed in collaboration with Calyos, who specialize in advanced thermal solutions that rely on Loop Heat Pipe (LHP) technology. Avid readers will probably recall that a few years ago he announced a case that could consume his 600W of power. While that chassis has never hit the market, the SG10 is expected to become a retail product.
For now, Streacom and Calyos are tight-lipped about their jointly developed SG10. A general principle used in all cases designed to allow passive cooling systems is that the chassis itself acts like a giant heatsink. This approach, on the other hand, requires a direct connection between the heat-generating chip and the case. This part is certainly tricky and here he Calyos demonstrates his LHP expertise.
600W doesn’t sound like much by today’s standards, but in reality such a machine could have an AMD Ryzen 9 7950X3D or Intel Core i9-13900K CPU and a GeForce RTX 4070 based graphics card, making it very Excellent performance.
The most interesting aspect of this fanless case is how it establishes efficient heat transfer between the heat-generating chip and the structure of the case. Usually users use custom made heat pipes and apply thermal his paste between them and a special cavity in the chassis. This is very difficult to do with the custom-designed graphics cards on the market these days.
In any case, Streacom and Calyos appear to be serious about bringing the SG10 to market, so they most likely have some convenient mechanism to “attach” the CPU and GPU to the heatsink, which is the chassis itself. It will be expensive.
