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TSMC Adds Advanced Packaging Capacity to Meet Nvidia Demands: Report

In recent years, artificial intelligence (AI), high-performance computing (HPC), and PCs have rapidly increased the demand for advanced process technologies, leading leading chip makers to expand their leading-edge production capacity to keep up. . Apparently, demand for advanced compute GPUs such as Nvidia’s A100 and H100 is so high that TSMC is planning to expand its advanced packaging capabilities. DigiTimes Report.

Current demand for packaging technologies such as Chip-on-Wafer-on-Substrate (CoWoS) far exceeds available production capacity, which is why TSMC is currently undertaking efforts to increase such capacity. is accelerating, says the report.

TSMC has reportedly committed to process an additional 10,000 CoWoS wafers for Nvidia in 2023. Considering Nvidia is getting around 60 or so A100/H100 GPUs per wafer (the H100 is slightly smaller), this would mean around 600,000 additional top-end data in the middle. GPUs.

This forecast suggests an increase of approximately 1,000 to 2,000 wafers per month for the rest of the year. Since TSMC’s monthly CoWoS output fluctuates between 8,000 and 9,000 wafers, by supplying Nvidia with an additional 1,000 to 2,000 wafers each month, he will help TSMC’s high-end his packaging facility. greatly improves the operating rate of The surge could lead to supply shortages of his CoWoS services to other industry players due to increased demand, which is why TSMC is reportedly planning to expand its advanced packaging capacity.

TSMC’s increased production is reportedly aimed at supporting growing demand for Nvidia’s AI chips, which have been widely adopted across the industry. For example, Google recently launched a new A3 supercomputer based on Nvidia’s H100. It boasts 26 ExaFLOPS of AI performance. Similarly, several high-profile companies, including Microsoft, Oracle, and even Elon Musk’s upcoming AI venture, have procured tens of thousands of his Nvidia AI GPUs over the past few months.

It is still unclear which specific compute GPUs Nvidia plans to power as the current lineup includes A100, A30, H100 and China exclusive A800 and H800 GPUs. All of his TSMC facilities that provide advanced packaging services are located in Taiwan.

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