AMD today announced a range of new products at its Data Center and AI Technology Premier Event here in San Francisco, California. The company has shared details about his EPYC Genoa-X processor with up to 1.1 GB of his L3 cache which is shipping now.
AMD also detailed its 5nm EPYC Bergamo processors for cloud-native applications, featuring Instinct MI300 processors with 3D-stacked CPU and GPU cores on the same package as HBM and a new GPU-only MI300X that also uses announced the model. Eight accelerators in one platform with a staggering 1.5 TB of HBM3 memory. All three of his products are available now, but AMD will also launch his EPYC Sienna processors for carriers and edge later in 2023.
AMD EPYC Genoa-X
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Like its predecessor Milan-X, AMD’s new Genoa-X is designed for a variety of technical workloads such as CAD design flows and EDA. The chip follows the same design philosophy as the company’s previous generation EPYC Milan-X processors, featuring 3D V-Cache. This is a radical new technology that uses hybrid bonding to vertically fuse an additional 64MB of 7nm SRAM cache on top of the Ryzen compute chiplet. Therefore, it triples the amount of L3 cache per die. AMD has adopted 2nd Gen 3D V-Cache in his Genoa-X and you can read more about the hybrid bonding technology here and here.
| processor | Price (1KU) | core/thread | Base/Boost Clock (GHz) | L3 cache (L3 + 3D V-cache) | TDP | cTDP(W) |
| Genoa-X 9684X | $14,756 | 96/192 | 2.55/3.7 | 1,152MB | 400W | ? |
| EPYC 7773X | $8,800 | 64/128 | 2.2/3.5 | 768MB | 280W | 225-280W |
| Genoa-X 9384X | $5,529 | 32/64 | 3.1/3.9 | 768MB | 320W | ? |
| EPYC7573X | $5,950 | 32/64 | 2.8/3.6 | 768MB | 280W | 225-280W |
| EPYC 7473X | $3,900 | 24/48 | 2.8/3.7 | 768MB | 240W | 225-280W |
| Genoa-X 9184X | $4,928 | 16/32 | .55/4.2 | 768MB | 320W | ? |
| EPYC7373X | $4,185 | 16/32 | 3.05/3.8 | 768MB | 240W | 225-280W |
Genoa-X brings the Zen 4 architecture to the next level with L3 cache up to 1.1 GB. That’s a 43% increase over the previous-generation model’s 768 MB. Genoa-X tops out at a 96 core model, a significant increase over the previous generation’s peak of 64 cores. The chip plugs directly into an existing SP5 socket, leveraging the existing server and workstation ecosystem. The chip hits a TDP of 400W for the 96-core model and extends to 320W for the 16-core chip.
AMD provided benchmarks showing Genoa-X going up against Intel’s 80-core 8490H Xeon with impressive improvements and comparisons to the same core-count Intel Xeon, again with noticeable performance across a range of technical workloads. showed an improvement in
Microsft also announced the general availability of new HBv4 and HX-series instances with Genoa-X, and new HBv3 instances in its Azure cloud. Azure also provided benchmarks showing up to a 5.7x performance improvement.
The details of the chip are currently under consideration. Please wait for the latest information.
