Gaming PC

AMD Instinct MI300 Details Emerge, Debuts in 2 Exaflop El Capitan Supercomputer

(Image credit: Marco Chiappetta)

AMD’s Instinct MI300 is shaping up to be an incredible chip that integrates CPU and GPU cores and massive slabs of fast memory on the same processor, but details are yet to be revealed. yeah. Here we have gleaned some new details from the International Super Computing (ISC) 2023 presentation outlining the upcoming 2 exaflop El Capitan supercomputer powered by the Instinct MI300. Other details were also revealed during his AMD Chief Technology Officer Mark Papermaster keynote at ITF World 2023, a conference hosted by research giant imec (you can read our interview with Papermaster here).

The El Capitan supercomputer is set to be the fastest in the world when it powers up in late 2023, displacing AMD-powered Frontier as the leader. The machine is powered by AMD’s mighty Instinct MI300, and new details include a topology map of the MI300 installation, photos of AMD’s Austin MI300 lab, and photos of the new blades that will be featured in the El Capitan supercomputer. . We also cover some other new developments in El Capitan deployment.

Mind you, the Instinct MI300 blends a total of 13 chiplets, many of them in the 3D stack, with 24 fused CDNA 3 graphics engines and 8 Zen 4 CPU cores. A data center APU that creates a single chip package with a Zen 4 CPU core. A stack of HBM3 memory totaling 128 GB. All in all, the chip has 146 billion transistors, making it the largest chip AMD has put into production. Nine compute dies that combine 5nm CPUs and GPUs are 3D stacked atop four 6nm-based dies, which are active interposers that handle functions such as memory and I/O traffic.

Papermaster’s ITF World keynote talks about AMD’s “30×25” goal of 30x power efficiency by 2025 and how computing is being controlled by power efficiency as Moore’s Law slows down. Focused. Key to that effort is the Instinct MI300, whose many benefits derive from the simplified system topology shown above.

As you can see in the first slide, the Instinct MI250 powered nodes have separate CPUs and GPUs, with a single EPYC CPU in the middle to coordinate workloads.

In contrast, the Instinct MI300 incorporates a 24-core 4th Gen EPYC Genoa processor inside the package, eliminating the need for a standalone CPU. However, except for the standalone CPU, the overall topology remains the same, allowing a fully connected all-to-all topology with four elements. This type of connection reduces latency and variability by allowing all processors to communicate directly with each other without using another CPU or GPU as an intermediary to relay data to other elements. This is a potential problem with the MI250 topology. The MI300 topology map also shows that each chip has his three connections, similar to what we saw with the MI250. Papermaster’s slides also refer to the active interposer that forms the base die as the “4th Generation Infinity Fabric Base Die”.

As you can see in the rest of these slides, the MI300 put AMD on a clear path to surpassing their 30X25 efficiency target while also beating the industry power trend. We’ve also posted some photos of the Instinct MI300 silicon that we’ve seen in person, but below you can see what his MI300 looks like inside the actual blade that will be installed in El Capitan.

AMD Instinct MI300 in El Capitan

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