Researchers at the Tokyo Institute of Technology presented an overview of new research results. BBCube hybrid 3D memory. BBCube 3D is short for “Bumpless Build Cube 3D”. This new type of memory could pave the way for faster and more efficient computing by improving the bandwidth between processing units (or PUs like GPUs and CPUs) and memory chips, they argue. It has been. The specific claim of this technology is to offer 30x the bandwidth of DDR5, or 4x that of HBM2E. Importantly, it achieves superior efficiency by reducing bit access energy to 20 times less than DDR5 memory and 5 times less energy than HBM2E uses.
BBCube 3D’s stacked architecture has “achieved the highest achievable performance in the world,” boasts the official Tokyo Tech News Blog. Before explaining how the BBCube 3D memory is designed, the researchers outline the challenges faced by designers using currently available memory technologies such as DDR5 and HBM2E. They argue that the desired higher bandwidth now comes at the expense of expensive, wider buses, or power-intensive data rate increases, or both.
So how does the BBCube 3D improve the integration between the PU and dynamic random access memory (DRAM)? The diagram above gives a basic overview of the BBCube 3D design. You can see that Pu is above the cache on the memory stack. All of this is housed on a silicon interposer base.
Furthermore, it is explained that “the lack of typical solder microbumps and the use of TSVs instead of longer wires results in lower parasitic capacitance and resistance.” This structure makes heavy use of the aforementioned through silicon vias (TSVs) to create a connection between the PU and the DRAM in his three dimensions.
Tokyo Tech’s claimed performance of BBCube 3D will make it very attractive for computing designs, thanks to its attractive combination of performance and reduced energy usage. Another desirable quality of the design attributed to power efficiency is said to alleviate “thermal management and power supply issues” that can occur in some of his 3D semiconductor designs.
There are currently no plans to commercialize BBCube 3D. Let’s work with scientists at the Tokyo Institute of Technology in the hope that this new technology will “paving the way for faster and more efficient computing.”
