Gaming PC

China’s Largest Chipmaker Delays New Fab, Sanctions Likely Root Cause

Semiconductor Manufacturing International Corporation (SMIC) recently said it would have to delay the start of mass production at its fab near Beijing by a quarter or two quarters “due to bottleneck equipment delays.”this is the first announcement This sort of thing happened after the US imposed broad sanctions on China’s semiconductor sector last October. However, the delay may not be due to a shortage of American-made tools, but to delayed Chinese-made tools.

Following the U.S. government crackdown on SMIC’s efforts to build chips using the 10nm-class production node and thinner ones, China’s major foundries are lining up in Beijing (Jingcheng), Shanghai (Lingang) and Shenzhen (Shenzhen). The company has announced plans to build four major 28nm 300mm fabs nearby. ), and Tianjin (Xiqing) to meet global and local needs for mature production capacity. Jingcheng, Lingang and Xiqing are all projected to be giga fabs with a capacity of at least 100,000 300 mm wafer starts per month (WSPM) when fully ramped up in the next few years.

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