Gaming PC

Intel Charts Course to Trillion-Transistor Chips: 2D Transistor Materials, 3D Packaging Research

Intel published nine research papers IEDM 2022 The company aims to deliver on its promise to develop processors with more than 1 trillion transistors by 2030, laying the foundation for future chip designs.

The work includes new 2D materials for transistors, new 3D packaging techniques that narrow the performance and power gap between chiplet and single-die processors to an almost imperceptible extent, and “remember when power is removed.” ” transistors, embedded memory. It can be stacked directly on top of transistors and can store multiple bits per cell.

Intel’s Component Research (CR) group lays the initial foundation for the company’s future technologies, but not all of these initiatives lead to marketable products. Those that hit the market usually arrive in 5 to 10 years.

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