Intel today announced Announced that its innovative immersion cooling technology won its first major customer, the US Department of Energy (DOE). Intel’s cooling technology will be developed and implemented in three years with his $1.71 million funding. This particular technology, which the DOE hopes to leverage in its data centers, was outlined in April, including new technology capable of cooling processors up to 2,000W. Intel is one of 15 organizations commissioned by the Department of Energy to develop cooling. Solutions for the data center of the future.
huge amount of money cooler chips program – Optimized cooling operation for energy, reliability and carbon super-efficiency leaps in information processing systems. This program is supported by the DOE Energy Advanced Research Projects Agency (ARPA-E). Apparently, the goal is to allow Intel to pack even more processing cores into its highest-performing processors, along with the reassurance that it has coolers capable of handling 2,000 W chips, thus allowing “Moore’s Law to continue.” It seems that By the way, today’s most powerful data center processor he is rapidly approaching 1,000 W.
Intel is working with a combination of academic and industry researchers to develop a two-phase liquid immersion cooling solution. Being a two-phase type means that it not only cools the electronics by immersing them in a liquid, but also enhances the cooling effect by changing the phase of the refrigerant. From Intel’s description, we can see that the immersion system is combined with a vapor chamber (the location of the phase change). Additionally, the heatsink within the phase change chamber adopts a sort of coral-like design for efficient fluid flow, enhanced by an innovative boiling-enhanced coating. The way the coral-like heatsink design is generatively created and 3D printed is reminiscent of cooling technology solutions advertised by Diabatix and Amnovis, but Intel’s press release specifically names industry partners. Not listed. As for the chamber coating, a nano-coating, possibly graphene, could be used because of its advertised “boil-promoting” properties.
Intel’s new liquid immersion cooling technology is said to be more efficient than any existing cooling technology, as well as enabling chips approaching or exceeding a TDP of 2,000W. This is important because Intel currently claims that cooling accounts for up to 40% of total data center energy usage. Intel says the team behind the project is looking to improve the two-phase system it’s developing. Its ambitious goal is to improve his 0.025°C/watt capability of existing systems by a factor of more than 2.5.
