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New US Sanctions Against China’s Chip Sector May Set it Back by a Decade

After the US government imposed sweeping sanctions on China’s semiconductor sector, the country’s semiconductor champion SMIC blocks access to wafer fab equipment that could be used to manufacture chips using the 14nm node and below. After that, we started working on even tighter limits. The US government is now ready to extend sanctions, and this time we will ensure that Japan and the Netherlands support them. The new sanctions will set China’s semiconductor sector back at least a decade.

Chinese chip makers seek to limit access to wafer fab equipment that can be used to make chips on 40nm-class process technology and below, reports the U.S. Digi Times, citing industry sources. If all restrictions are imposed and export licenses are not given to him to sell advanced chip-making tools to SMIC and other Chinese chip makers, this could set the People’s Republic’s semiconductor industry back at least a decade. Become. But it also hits wafer fab equipment (WFE) manufacturers, potentially impacting the industry as a whole.

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