Gaming PC

SK hynix Starts Mass Production of Speedy, 238-Layer NAND

SK hynix Said The company announced late Wednesday that it has begun mass production of a 238-layer “4D” (actually a kind of 3D) NAND memory device that enables high-performance and high-capacity SSDs. The new chip boasts a data transfer rate of 2400 MT/s and can be used to drive the next-generation best SSD, the high-speed model with PCIe 5.0 x4 interface and offering sequential read/write speeds of 12 GB/s. increase. taller than.

From a performance PC enthusiast’s point of view, the main advantage of SK hynix’s 238-layer TLC NAND IC is its interface speed of 2400 MT/s. This represents a 50% increase over the previous generation, and 3D NAND devices with a 1600 MT/s interface cannot deliver PCIe-saturating transfer speeds, making sequential read/write speeds above 12 GB/s unacceptable. Values ​​required to build an SSD. Gen5 x4 interface.

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