SK hynix Starts Mass Production of Speedy, 238-Layer NAND
SK hynix Said The company announced late Wednesday that it has begun mass production of a 238-layer “4D” (actually a kind of 3D) NAND memory device that enables high-performance and high-capacity SSDs. The new chip boasts a data transfer rate of 2400 MT/s and can be used to drive the next-generation best SSD, the high-speed model with PCIe 5.0 x4 interface and offering sequential read/write speeds of 12 GB/s. increase. taller than.
From a performance PC enthusiast’s point of view, the main advantage of SK hynix’s 238-layer TLC NAND IC is its interface speed of 2400 MT/s. This represents a 50% increase over the previous generation, and 3D NAND devices with a 1600 MT/s interface cannot deliver PCIe-saturating transfer speeds, making sequential read/write speeds above 12 GB/s unacceptable. Values required to build an SSD. Gen5 x4 interface.
SK Hynix’s first 238-layer 3D NAND device is a 512Gb (64GB) 3D TLC device with 34% higher manufacturing efficiency than comparable devices made on the company’s 176-layer 3D NAND node, the company said. Assuming a high yield of 238L TLC NAND IC, the bit cost can be significantly reduced by up to 34%, making the device more cost competitive. In addition to being smaller than its predecessor, the new device is said to consume 21% less power when reading, which benefits mobile PCs as well as smartphones.
Typical of SK Hynix, the 238-layer NAND device uses a Charge Trap Flash (CTF) design and employs the company’s proprietary Peripheral Under Cell (PUC) layout, a feature the manufacturer calls “4D” NAND. I’m here. This particular layout allows the size of memory devices to be reduced, thus helping SK Hynix to further reduce the cost of his NAND.
SK Hynix plans to use the new 238-layer memory first in smartphones before expanding its use across its portfolio of other products.
“SK Hynix has developed a solution product for client SSDs used as storage devices for smartphones and PCs using 238-layer NAND technology, and started mass production in May,” the company said in a statement. “Since we have secured world-class competitiveness in terms of price, performance, and quality for both 238-layer NAND and the previous generation 176-layer NAND, we expect these products to drive earnings improvement in the second half. I have.”