Advanced chips manufactured using state-of-the-art process technology often require high-quality multi-layer motherboards. To ensure that such printed circuit boards (PCBs) can be produced in the United States, President Joe Biden this week said: signed Presidential decision authorizing $50 million to support the domestic PCB and advanced chip packaging industry using the Defense Production Act (DPA).
The gradual migration of high-tech industries from the United States to Asia in recent decades has impacted not only advanced semiconductor production and mass assembly of consumer electronics, but also chip packaging and PCB production. I was. Meanwhile, all electronic devices (from tiny mice to mission-critical servers and military equipment) Several Being a kind of motherboard, the ability to produce sophisticated PCBs in the US is also a matter of national security.
The president’s decision allows the Department of Defense to use $50 million to provide. DPA Title III Incentive — Includes purchases and purchase commitments — To support the US PCB and advanced packaging industry
Although the U.S. government has an interest in manufacturing PCBs for use in defense, energy, healthcare, and other critical areas of America, the companies that receive subsidies from the Department of Defense generally rely on advanced technology. You can get the technical competence and know-how you need to manufacture your perfect substrate. As a result, it will be able to serve other sectors. Whether this will eventually bring production of things like graphics cards and PC motherboards back to the US remains to be speculated. There is no doubt that it is possible.
In fact, many companies such as AMD, Apple, Google, Intel, Nvidia, etc. produce various motherboards for their devices for testing purposes in the US before mass production begins in Asia. Given the right financial incentives, at least some American company could potentially expand his PCB and packaging operations in the US to serve customers here.
“In the absence of Presidential action under Section 303 of the Act, U.S. industry could not reasonably be expected to provide necessary industrial resources, materials, or capabilities of critical items of technology in a timely manner. You can’t,” Biden said. wrote in a note“Action to expand domestic production capacity for printed circuit boards and advanced packaging has proven necessary to avoid shortages of industrial resources or critical technology items that would seriously undermine our national defense capabilities. “
