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U.S. Govt Considering Plans to Crackdown China’s Domestic 3D NAND Production

In recent years, the US government has taken steps to crack down on the production of logic chips in China using advanced manufacturing processes. to prevent the country from improving its military capabilities. In addition to logic chips, US authorities are now considering crackdowns on China’s 3D NAND manufacturing industry. The biggest problem is that it affects not only domestic manufacturers but also Samsung and SK Hynix.

The U.S. government is considering banning shipments of U.S. 3D NAND manufacturing equipment to Chinese flash memory makers with more than 128 layers, which is the only domestic 3D NAND maker in China, Yangjiang. Reported to affect Memory Technology (YMTC). Reuters Citing sources familiar with the matter. Moreover, such a move would also hit Samsung and SK Hynix, which also produce his 3D NAND memory in China.

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