YMTC has started shipping Zhitai TiPlus7100 SSD based on the latest 232-layer 3D NAND Xtacking 3.0 memory with 2400 MT/s interface. IT home report. With this, YMTC’s latest 3D NAND memory (required to manufacture SSDs with PCIe 5.0 x4 interface, which fully saturates this interface and reaches sequential read speeds of 12.4 GB/s) is now in mass production. is confirmed.
of YMTC Chitai TiPlus7100 The M.2-2280 PCIe 4.0 x4 drive is designed to combine affordability with powerful performance. The SSD comes in 512GB, 1TB, and 2TB versions and is rated for the fastest sequential read speeds up to 7000 MB/s and sequential write speeds up to 6000 MB/s.
In terms of random performance, the 1 TB and 2 TB models are configured to deliver up to 900K random read IOPS and up to 700K random write IOPS. TiPlus7100 drives do not have SDRAM buffers and use host memory buffers. This shows that we are dealing with affordable products. On the other hand, these drives can easily challenge the best SSDs available today.
|interface||PCIe 4.0 x4, NVMe 1.4||PCIe 4.0 x4, NVMe 1.4||PCIe 4.0 x4, NVMe 1.4|
|Sequential read rate||7000MB/s||7000MB/s||7000MB/s|
|Sequential write speed||3600MB/s||6000MB/s||6000MB/s|
|Random read (4K)||800K IOPS||900K IOPS||900K IOPS|
|Random write (4K)||600K IOPS||700K IOPS||700K IOPS|
|MTBF||1.5 million hours||1.5 million hours||1.5 million hours|
|guarantee||5 years||5 years||5 years|
YMTC has not disclosed which controller it uses for its Zhitai TiPlus7100 SSDs, but the main point about these drives is that they use the company’s 1Tb X3-9070 chip, a 232-layer 6-plane 3D TLC NAND memory device, 2400 MT. is doing /s interface and the company’s own Xtacking 3.0 architecture.
The 1Tb X3-9070 device not only boasts a bit density of 15.03 Gb/mm^2 ( Tech Insight), far exceeding the bit density of 1Tb 3D TLC NAND memory ICs with less than 200 layers, but also with a super-fast 2400 MT/s interface.
Earlier this week, Micron announced its micron 2550 drive It is based on a 232-layer 6-plane 3D TLC NAND device which is said to have a bit density of 14.6 Gb/mm^2, surpassing YMTC’s 232-layer 3D TLC IC in terms of bit density. On the other hand, Micron’s ICs currently shipping include: 1600 MT/s interfaceThat’s good enough for mainstream drives, but not enough for ultra-high performance SSDs with PCIe 5.0 x4 interfaces.
|row 0 – cell 0||YMTC||micron||samsung||WD/Kioxia||SK Hynix||YMTC|
|Sending||232 layers||232 layers||128 layers||162 layers||176 layers||128 layers|
|density per square millimeter||15.03GBmm^2||14.6GBmm^2||6.91GBmm^2||10.4GBmm^2||10.8GBmm^2||8.48GBmm^2|
|dice capacity||1 terabyte||1 terabyte||512GB||1 terabyte||512GB||512GB|
|Next Generation (Release date)||?||?||3xx (unknown)||212 (unknown)||238 layers (2023)||196 layers (second half, 2022)|
So YMTC is not the only company to mass produce over 200 layers of 3D NAND, but it is the first to mass produce memory with 2400 MT/s I/O. However, this won’t last long as Micron plans to begin production of his 232-layer 3D NAND with a 2400 MT/s interface in early 2023.