China-based Yangtze Memory Technology (YMTC) announced: Latest version of Xtacking NAND technology (now in its 3rd generation), ushering in a new era of increased speed, density and power efficiency. According to the company, the latest NAND chip (X3-9070) has 50% better performance than the previous design (based on 128-layer Xtacking 2.0 technology) and doubles the density to 1TB per chip. . Combined with the 25% reduction in power consumption despite the speed increase, it looks like Apple could find even more reasons to adopt the company’s technology.
Gregory Wong, Founder and Chief Analyst at Forward Insights, said: “Hybrid bonding of storage arrays and peripheral logic circuitry has proven to be essential in driving the development and innovation of 3D NAND technology.”
YMTC’s Xtacking 3.0 technology improves performance by 50% over the previous generation, reaching 2,400 MT/s, surpassing the previous generation’s maximum of 1,600 MT/s. The company cites improvements in both performance and power efficiency with the adoption of a 6-plane NAND design instead of the more traditional 4-plane of the previous generation, also mocking the fact that the density has doubled from his It’s not a thing, but a necessary development in a world with ever-increasing data storage needs.
Interestingly, it looks like YMTC has yet to roll out their 196-layer NAND design with the announcement of their X3-9070 NAND chip. The company’s next-generation NAND technology was set to begin production in the second half of this year, but there has been no mention of it in mass production yet. tick tock Similar to the manufacturing and research process, we first find new six-sided designs, improve yields, and later introduce new layer densities.
Despite technological advances, YMTC still lags behind Micron and other NAND makers around the world. Micron announced mass production of his 232-layer NAND technology later this year. It has some impressive density and performance characteristics. SK Hynix, on the other hand, is eager for its own press with a 238-layer design. YMTC’s battle continues to be an uphill battle, but what the company has achieved is impressive, having deployed only two of his 300mm wafer fabs for actual production. The company needs to scale further to gain a sizable market share, but its investment in research and development appears to be paying off despite continued US pressure.
China, in particular, has one of the largest servicing markets in the world, and companies around the world are glistening at its market and potential revenue. Increased pressure by the United States on Chinese technology imports has led Chinese leaders and their companies to focus on developing domestic technologies that serve not only the Chinese market, but also various multi-billion dollar technology markets. I was. NAND is only part of it, but he’s worth $66.52 billion in 2021 (expected to reach $94.24 billion by 2027).
