Micron announced Wednesday its first UFS 4.0 compliant storage device. The company’s latest generation of single-module smartphone storage devices is set to be the fastest ever, incorporating a new faster NAND within the storage device as well as offering a combination of improvements derived from the UFS specification itself. . Micron expects the company’s UFS 4 devices to be used in upcoming flagship smartphones, tablets, and ultra-low-power notebooks already this year.
Micron’s UFS 4.0 storage devices come in three capacities: 256 GB, 512 GB, and 1 TB, and rely on the company’s proprietary controllers. The high-end 512 GB and 1 TB UFS 4.0 products use Micron’s 232-layer 6-plane 1 Tb 3D TLC NAND devices, which can deliver up to 4,300 MB/s sequential read speeds and up to 4,000 MB sequential write speeds. increase. /s and, based on data provided by Micron, is the best performing UFS storage module of his for smartphones to date. The 256 GB unit uses a quad-plane 3D NAND device, which is slightly slower.
Micron’s new UFS 4.0 storage module is fully spec compliant and uses two M-PHY Gear 5 lanes for data transmission. In addition, data stream separation (separate frequently used and infrequent data on the device to reduce background garbage collection), automatic read bursting (uses device defragmentation after extended use) to improve read performance). time), and eye monitoring (ensuring signal integrity).
In addition to offering higher performance than its predecessor, Micron’s UFS 4.0 modules are said to deliver 25% more energy efficiency through a combination of higher performance and energy-saving features.
“Micron’s latest mobile solutions tightly weave our best-in-class UFS 4.0 technology, proprietary low-power controller, 232-layer NAND, and highly configurable firmware architecture to deliver unparalleled performance. said Marc Montias, corporate vice president and general manager. Micron’s mobile division.
The use of high-capacity 232-layer 3D TLC NAND devices also allows Micron to make the UFS 4.0 module considerably thinner. According to the company, the Z-height does not exceed 0.8 to 0.9mm, which will allow mobile phone makers to make their products slimmer and use higher capacity batteries.
Micron is currently sampling UFS 4.0 storage modules with leading smartphone makers, and expects these units to be in use within months or quarters after mass production begins in the second half of this year.
